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TMMBAT 42 TMMBAT 43
SMALL SIGNAL SCHOTTKY DIODES
DESCRIPTION General purpose, metal to silicon diodes featuring very low turn-on voltage fast switching. These devices have integrated protection against excessive voltage such as electrostatic discharges. ABSOLUTE RATINGS (limiting values)
Symbol VRRM IF IFRM IFSM Ptot Tstg Tj TL Parameter Repetitive Peak Reverse Voltage Forward Continuous Current Repetitive Peak Fordware Current Surge non Repetitive Forward Current Power Dissipation Storage and Junction Temperature Range Maximum Temperature for Soldering during 15s Tl = 25 C tp 1s 0.5 tp = 10ms Tl = 65 C
MINIMELF (Glass)
Value 30 200 500 4 200 - 65 to 150 - 65 to 125 260
Unit V mA mA A mW C C C
THERMAL RESISTANCE
Symbol Rth(j-l) Junction-leads Test Conditions Value 300 Unit C/W
August 1999 Ed: 1A
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TMMBAT 42/TMMBAT 43
ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS
Symbol VBR VF* Tj = 25C Tj = 25C Tj = 25C Tj = 25C Tj = 25C Tj = 25C IR* Tj = 25C Tj = 100C Test Conditions IR = 100A IF = 200mA IF = 10mA IF = 50mA IF = 2mA IF = 15mA VR = 25V BAT 43 0.26 All Types BAT 42 Min. 30 1 0.4 0.65 0.33 0.45 0.5 100 A Typ. Max. Unit V V
DYNAMIC CHARACTERISTICS
Symbol C trr Tj = 25C VR = 1V Tj = 25C IF = 10mA Test Conditions f = 1MHz IR = 10mA irr = 1mA RL = 100 80 Min. Typ. 7 5 Max. Unit pF ns %
Tj = 25C RL = 15K CL = 300pF f = 45MHz Vi = 2V
< 2%.
* Pulse test: tp 300s
Figure 1. Forward current versus forward voltage at different temperatures (typical values).
Figure 2. Forward current versus forward voltage (typical values).
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TMMBAT 42/TMM BAT 43
Figure 3. Reverse current versus junction temperature. Figure 4. Reverse current versus continuous reverse voltage (typical values).
Figure 5. Forward current versus forward voltage (typical values).
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TMMBAT 42/TMMBAT 43
PACKAGE MECHANICAL DATA MINIMELF Glass
A
DIMENSIONS REF. Millimeters Min.
/ OB
Inches Min. 0.130 0.063 0.016 Typ. 0.134 0.063 0.018 0.059 Max. 0.142 0.064 0.020 3.6 1.62 0.50
Typ. 3.40 1.60 0.45 1.50
Max.
A B C D
3.30 1.59 0.40
C
C
FOOT PRINT DIMENSIONS (Millimeter)
2
2.5 5
Marking: ring at cathode end. Weight: 0.05g
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com
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